


1. 簡(jiǎn)介和應(yīng)用
2. 品牌/規(guī)格:AMT
Sn96.5/Ag3.0/Cu0.5
3. 焊料成分:As listed (J-STD-006B)
|
Type(合金代號(hào)) |
|
AW305 |
|
Item No (項(xiàng)目) |
Ingredients(成分) |
Content(含量)Wt% |
|
1 |
1.錫(Sn) % |
余量(Rest) |
|
2 |
2.銻(Sb) % |
0.050max |
|
3 |
3.銅(Cu) % |
0.5±0.1 |
|
4 |
4.鉍(Bi) % |
0.030max |
|
5 |
5.鋅(Zn) % |
0.002max |
|
6 |
6.鐵(Fe) % |
0.020max |
|
7 |
7.鋁(Al) % |
0.002max |
|
8 |
8.砷(As) % |
0.030max |
|
9 |
9.鎘(Cd) % |
0.002max |
|
10 |
10.銀(Ag) % |
3.0±0.2 |
|
11 |
11.鉛(Pb) % |
0.050max |
|
Solids Temperature (固化溫度) |
217℃ |
|
Liquids Temperature (熔化溫度) |
219℃ |
|
Specific Gravity (比重) |
7.42 |
|
Physical State (物理狀態(tài)) |
銀色線體 |
|
Content of the flux (助焊劑形態(tài)) |
2.0-4.0% , 3芯或5芯 |
|
Type of the flux (助焊劑類型) |
REL0 |
|
Spread rate (擴(kuò)散率)JIS-Z-3197-1999-8.3.1.1 |
>80 |
|
SIR (表面絕緣阻抗)JIS-Z-3197-1999-8.5.3 梳子2形 |
>1.0x1011Ω |
|
Water Solution Resistance(水溶性) |
>5×104 |
|
Copper Test(銅板腐蝕試驗(yàn)) JIS-Z-3197-1999-8.4.1 |
Pass |
|
Soldering Temperature (焊接推薦溫度) |
Recommend: 360oC -380 oC |
5. 錫絲可制造直徑
0.18-3.0mm
6. 包裝方式
0.5kg/卷,1Kg/卷, 10Kg/卷.
5kg/盒,10kg/盒.